CAD Design Software is awarded in the Top 10 Semiconductor Packaging Solutions Companies of 2023 – With the advancing functionalities of integrated circuits (IC), there has been an industry-wide push toward more efficient packaging to optimize their performance. Semiconductor manufacturers look for innovative electronic design automation (EDA) software with the flexibility to simulate various design scenarios and test the manufacturability of complex IC packaging structures.
Design Suites Created for You
Popular Conversion and Output Tools
Your Technology Supported
IC Packaging Technology
Contains powerful tools that have been developed in direct response to the needs of the world’s largest silicon and packaging companies.
Ceramic MCM / LTCC
Supports designs for all types of MCM technologies. A dedicated hybrid library allows a user to save bare die and dies with wires.
3D Solids from Designs
3D models made from 2D outlines of components, substrates, cavities and holes and bond wires to create true 3D ACIS compatible solids.
RF / Microwave Technology
Provides tools that enhances the design of RF / Microwave / Wireless printed circuit boards and creation of complex embedded circuits.
The PCB layout environment is a core set of EDA tools to natively supports all major features for PCB circuit design technologies.
Provides tools to speed up the design of flexible printed circuits with true arcs teardrop fillets with in DRC and Gerber