EDA Software Built by Designers for Designers

With the advancing functionalities of integrated circuits (IC), there has been an industry-wide push toward more efficient packaging to optimize their performance. Semiconductor manufacturers look for innovative electronic design automation (EDA) software with the flexibility to simulate various design scenarios and test the manufacturability of complex IC packaging structures.

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CAD Design Software is awarded in the Top 10 Semiconductor Packaging Solutions Companies of 2023  – With the advancing functionalities of integrated circuits (IC), there has been an industry-wide push toward more efficient packaging to optimize their performance. Semiconductor manufacturers look for innovative electronic design automation (EDA) software with the flexibility to simulate various design scenarios and test the manufacturability of complex IC packaging structures.

Design Suites Created for You

BGA
EPD Professional
Design Suite

Semiconductor Packaging designers plus routing, GDS In/Out and Hybrid MCM, Die Bump, BGA, Lead Frame

Standard
EPD Standard
Design Suite

Substrate and Ceramic designers PCB, RF, Flex, Schematic, Ceramic MCM, LTCC, HTCC, Thick/Thin Film

ICBGA
EPD Basic
Design Suite

Substrate design tools for PCB, RF, Flex, Schematic, Bi-Direction Gerber and GDS, 3D tools

basicsuite
EPD Starter
Design Suite

Introduction Suite that contains PCB, Schematic, DRC, Parts Creation, Gerber Output tools

Popular Conversion and Output Tools

bwxexport
Bond Wire Export

Outputs bond wire data such as Bond wire X,Y Location, Material Type, Directional Arrows and Numbered Sequence to an XML format

acam
ACAM - A Gerber and GDSII Tool

Effortlessly create or Read In Gerber or GDSII translation code from DWG / DXF drawings or Input from all Popular and Legacy formats

Your Technology Supported

grouppackages
BGA

IC Packaging Technology

Contains powerful tools that have been developed in direct response to the needs of the world’s largest silicon and packaging companies.

rf3d_02

Ceramic MCM / LTCC

Supports designs for all types of MCM technologies. A dedicated hybrid library allows a user to save bare die and dies with wires.

Leadrrame

3D Solids from Designs

3D models made from 2D outlines of components, substrates, cavities and holes and bond wires to create true 3D ACIS compatible solids.

3d_mcm

RF / Microwave Technology

Provides tools that enhances the design of RF / Microwave / Wireless printed circuit boards and creation of complex embedded circuits.

master_pcb

PCB Technology

The PCB layout environment is a core set of EDA tools to natively supports all major features for PCB circuit design technologies.

flex_011

Flex Technology

Provides tools to speed up the design of flexible printed circuits with true arcs teardrop fillets with in DRC and Gerber

NewADN

Application Plugins for AutoCAD

CDS has diligently worked to extract and bring you the individual features of many of these powerful tools. These once esoteric tools are now available right here as extremely cost effective AutoCAD add-on utility apps!

  • Autodesk Platforms Microsoft Windows 7, 8, 10
  • Autodesk Platform Versions: 2018-2024
  • AutoCAD LT is Not supported
  • AutoCAD Electrical, Architecture, Civil 3D 
  • Standard AutoCAD, Mechanical