Packaging Documentation (DOC)

The Packaging Documentation module automatically generates packaging documentation by creating complex cross sections with dimensions, tables of information, wire bonding diagrams, and other detailed fabrication and assembly diagrams. Places reference text directly onto the layout to assist in design and assembly.

Key Features:

  • Configurable automatic data tables with dozens of information fields to choose from.

  • Automatic wirebond diagrams including multiple diagrams for optional dies configuration.

  • Extracts any view of a design into a new data file.

  • Automatically draws BGA outline installation diagrams.

  • Converts two ways between tables in the drawing and Excel files.

  • Automatically labels bonding pads with Net and / or BGA pin data at any angle.


  • Automatically draws top, bottom and side views of a BGA or PGA package with all dimensions and tolerances.

  • Labels bonding pads with the BGA ball pin numbers or netname. Angles may be ortho or at the angle of the bondpad.