Lead Frame  Design Technology (LFD)

The Lead Frame Technology is a set commands to take all types of lead frame design patterns and make intelligent. This technology is the main module in the Master lead Frame Suite for use when creating or converting complex lead frame designs. 

This semi-automatic, yet extremely fast process to turn Lead Frame designs that were manually drawn to the standard CDS data format. LFintel intelligizes the metal and AttIntel intelligizes the die and the bond wires. Configuration files made during one intelligization can be saved and re-used to automatically configure similar jobs.

See our Lead Frame Library Search software to filter large libraries of EPD-intelligized Lead Frames and provides a search function for best available Lead Frame for a die.


Key Features Include:

  • Clean up old Lead Frame drawings using Lclean and AutoJoin commands.

  • Intelligize the cleaned up polylines using the LFintel command. Design is now ready for die and wire placement in EPD or APD.

  • Wire bonding may be initialized from a fixed netlist made by APD, another system or automatically created based on optimizing the connections to keep them short

  • Bonding diagram automation may be customized to your company specifications, including automatic placement of details and initializing data in your company’s format.

  • The die and wirebonding done inside APD during co-design may be read back into the EPD LeadFrame design software for Advanced DRC and final documentation.

The Lead Frame Intelligizer module captures the lead tips as it converts legacy unintelligent drawings into intelligent designs compatible with Cadence’s APD and SIP and Ansys HFSS, Q3D and CST Microwave Studio (MWS) analysis tools.

Modifying Existing Intelligent Lead Frames



Intelligent lead frames can be modified while maintaining the spacing of surrounding leads by distributing the changes evenly. Using the KNitro® engine to make the calculations, the design can be changed for lead length, width, gaps, pull-backs, adding or removing power bars and much more.

This software works on an intelligent lead frame and automatically makes it a parametrically editable model. It can make hundreds of changes in just minutes. For example, it can change the width of all the internal lead tips by reducing the gap between the leads; it can increase the width of one lead by removing a tiny amount of space from all the gaps on the same side. It has an automatic process which reduces gold wire usage by optimizing the distance from the lead tips to the DAP.

Lead Frame Patterns created Parametrically


Sections of lead tips may be generated parametrically to follow any shape leading edge and then arrayed or joined to make a complete Lead Frame. The PLACEDIE command can replace dies in existing designs or place them in new designs or intelligized Lead Frame blanks using automatic bond wire generation with or without a net list. It even places stacked dies or side by side stacked dies in a Lead Frame.
  • Lead tip creation and array.

  • Creation of the DAP, ground ring, tie bars, and external leads.

  • Auto-routing of the internal leads between the lead tips and the external leads.

  • Creation of the Power bars.

  • Placement and wire bonding of the die.

Create a full lead frame with die and wires based on the inner tips or Bond pad openings Video Demo:


Automatic Design of New QFN Style Lead Frames Video Demo:


Creating a full QFN-type leadframe using parameters to create many areas that would need accurate values. Quickly update an existing design to modify number of leads, length, offset and much more. 


This parametric dialog driven tool automatically makes unlimited variations of QFN type lead frames with complex patterns of internal leads just by typing numbers into the multi tab dialog box. Then the Lead Frame Base Tool can be used to place the Die and the Bond Wires.