Ceramic MCM / LTCC Design Technology (CERM)

The Ceramic MCM Technology is an advanced parametric commands create embedded / laser tunable resistors, capacitors, inductors, multi-tiered cavities and other special components. An automatic mask generator makes all the extra necessary dielectric and other masks for complex Ceramic type substrates and can be configured to support new technologies.

Key Features Include:

  • All types of Ceramics supported; Thick Film, Co-Fired, Thin Film, etc...

  • Circuits and components may be built up on both sides of a ceramic design

  • Intelligent links to wire bonding machines

  • Multiple bare die can be connected either by wire or flip chip (direct contact)

  • Dielectric layers can be setup for punching out of vias and cavities

  • Additional conductive and dielectric paste prints can be incorporated in the design

  • Material Library and Editor includes many popular industry standard materials

  • 3D creation with custom Bondwire Profiles (see the 3D Module).


Automatic intelligent die creation from: 

  • Die files come from many different sources and EPD has created multiple ways to import the die package information for use in your design through:

    • MS Excel®, AutoCAD® DWG or DXF Data, GDS Data, DIE or LIQ files, Digital Photographs.

    • These methods are:

      • Reading two types of standard data files: .Liq and .Die

      • Converting a non-intelligent die drawing made by our GDSII-AutoCAD converter

      • Parametrically input die parameters to create custom dies.

      • Scanning a DIE photograph and capturing the data

      • Analyze unintelligent AutoCAD DWG & DXF drawing artwork and also capture pin numbers and signal text.

      • Import tab-delimited files (created with programs such as Excel) that contain coordinates and die dimensions and convert them to LIQ files

Die Attach Pattern Control:

  • Multiple row bondwire groups

  • Power rings for bondwire connections

  • Embed information for bondwire material, diameter, length, angle, etc.

  • Wire Diameter and length control

  • Assign bondwire profiles for single or multiple stacked die.

  • Substrate Bond Pad control

  • Die Bonding Pad control

  • Built in Bondwire Fanout types

  • Real-time DRC checking

Via Creation:

  • LTCC interconnect technology is available through flexible via creation, which includes support for through hole and blind/buried construction for all technologies.

  • Combinations of through hole and blind/buried vias are created as blocks to form stair-stepped vias, tunnel vias (similar to through hole), straight vias, and spiral vias.

  • PCB Technology

    • Through Hole

    • Blind/Buried

  • Ceramic/MCM Technology

    • Tunnel (Through Hole)

    • Blind/Buried

    • Stair-stepped

    • Spiral

Printed Resistors with Laser Trimming Kerf:

  • Printed resistors are created with printed resistive paste (often called ink and rated in Ohms/Square) material in specific length / width ratios. This eliminates the large traditional resistor components.

  • Features found in a variety of printed resistors include:

    •  Size calculations are based on design rules, and paste characteristics (Resistance, aspect ratio, Ohms per Square, Watts per Sq mm)

    • Shapes include rectangular, top-hat or right angle (L-shaped)

    • Over-glaze with its required overlap

    • Via Keep Out, Trace Keep-out

    • Processing tolerances before and after firing and trim values and tolerances

    • Multiple Prints may be required to get Desired Ohms / Square

    • Calculation of Geometries is based on Min / Max resistance requirement

    • Wattage capacity is based on material properties and coverage area

    • Output laser trimming information directly to the Laser Trimming machine

    • Netlist intelligence even when Embedded on internal layers

Serpentine Resistors:

  • Ladder Tuning for Larger Resistance

  • Automatic generation based on min / max resistance values

  • Automatic wattage calculations based on material properties

  • Output data directly to laser trimming machine

Multi-Tiered Cavities:

  • Parametric control system for starting Level, number of tiers, shelf X & Y Offset and Curved Radius value

  • Assignment of the number of levels deep from either side of the substrate

  • Multiple cavity offsets from the defined base cavity for stepped cavity creation

  • Assignment of keep out perimeters for vias and traces

  • Enable connecting dies to inner layers without vias

  •  To enable connecting dies to inner layers without vias the LTCC manufacturing system allows for the design of cavities. The following features are allowed in a cavity.

    • Any number of levels deep from either side of the substrate

    • Multiple offsets from the defined base cavity for stepped cavity creation with shelves

    • Assignment of keep out perimeters for vias and traces

CAM Output:

  • Automatic CAM Configuration includes:

    • Nibbler Data Auto generation and Machine Compatible Output

    • Output for wire bonding, epoxy dispense and component placement machines

  • Gerber Output with:

    • Rotation about any point

    • Equal or Unequal X,Y Scaling

    • Mirroring on any axis, X or Y

    • Punch (drill) Output

    • Four types of Punch Optimizations

    • Panelization