Bond Wire Export to Hesse Mechatronics Wire Bonders

The versatility and advanced capabilities of Hesse Mechatronics machines are enhanced by CAD Design Software’s porting tool, so that your design data can quickly and seamlessly be running on your Hesse Mechatronics wire bonder. Design edits, as needed, can quickly be implemented within the software and onwards to the shop floor, saving valuable machine programming downtime.

The Hesse Mechatronics Utility Module creates an XML data file that contains wire bond information of polylines in a DXF/DWG file. This XML data file can be used with Hesse Mechatronics wire bonding machines that accept XML data format.

Setup Tools for the Bond Wire diagram

  • Export to Hesse Mechatronics Wire Bonders - BJ820, BJ935, BJ939

  • Sequence numbers and direction arrows will be visible in the drawing.

  • Multiple bond wire groups / dies can be set with unique References

  • Create individual bondwire reference blocks.

  • Pick or Fence polyline / bond wires to set sequence numbers and bonding direction arrows for the bond diagram.

  • Assign wire types to be included in the XML output. Wire types can be set up to correspond to unique profiles for quick and repeat usage.

  • Update existing blocked entities such as the dies or chips with Reference points that will be included in the XML output.

  • Assign a name for the Bond wire reference (BDS) for the selected wires. If other bond wire blocks will be in the drawing, this attribute will allow a unique name for each.

  • Assign the Reference a Sequence Number (BDR), which controls the order in which each will appear in the exported XML file.

  • Assign a parent name (DEPENDON) to use as a reference system.

  • Set a symbol text (REFP1, REFP2) to be used as a first and second reference point.

Exporting the Bond Wire information

  • Add direction arrows and sequence numbers to the drawing and set size of text and arrow size.

  • An array of wire bond data can be exported when an array of identical parts is being wire bonded. The following parameters are available:

    • Set a Pitch of the array in the X (horizontal) dimension.

    • Set a Pitch of the array in the Y (vertical) dimension.

    • Set a Quantity of arrayed parts counted in the vertical dimension.

    • Set a Quantity of arrayed parts counted in the horizontal dimension

Sample XML Output: