CAD Design Software - News and Announcements

Press Release – New Software Version

CDS announces the release of Version 7.4.

CAD Design Software releases the latest version of their leading-edge circuit layout tools for the IC packaging, RF/Microwave, Hybrid/MCM, and PCB layout industries, incorporating advanced interoperability capabilities.

January 18, 2006, San Jose, Calif.—CAD Design Software announces the release of the latest version of their advanced layout tools. Two years in development, Version 7.4 is the largest and most extensive expansion of CAD Design Software’s high-end EDA tools and is the culmination of extensive collaborative relationships with many industry leaders in the U.S., Japan, and Asia in the Semiconductor Packaging, Hybrid/MCM, IC Test, and RF/Microwave fields.

“Because of our ongoing partnership with the top industry leaders, we have not only been able to rapidly implement enhancement requests, but have been able to jointly develop new layout solutions for emerging technologies as well as create previously unavailable 3D manufacturing verification systems. This has resulted in our most advanced and expanded 3D layout solutions for leading-edge IC packaging, IC Test, RF, and MCM layout”, said Gordon Jensen, president of CAD Design Software. 

More robust, sophisticated algorithms for faster processing and CAD Design Software’s award-winning Bond Wire Optimization and 3D design tools are among the hundreds of enhancements and improvements that help reduce design time, improve overall time-to-market, and verifiably improve yields.

CAD Design Software‘s Version 7.4 is unsurpassed in features, functions, and most of all, flexibility. CAD Design Software leads the EDA industry with the most rapid development and implementation of new tools for emerging high-end new technologies for its customers. This has resulted in many industry firsts, including Stacked Die, 3D design, automated IC package routing, co-development and design-for-manufacture (DFM) platforms.

Version 7.4 is available now from CAD Design Software and its channel partners. For more information call 408.436.1340 or visit us at

About CAD Design Software:
CAD Design Software provides complete 3D Electronic Design Automation solutions for semiconductor packaging and PCB designs disciplines using Electronics Packaging Designer (EPD) software suites for applications such as BGA, uBGA, Hybrid/MCM, Lead Frame, Stacked Die, IC Test, RF/Microwave, Flex and other design technologies. For more information on CAD Design Software, call 408.436.1340, visit our web site at, or e-mail us at